| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid state image pickup device which can reduce an influence of foreign materials and flaws on a translucent plate which covers an imaging region though being a packageless solid state image pickup device.SOLUTION: A solid state image pickup device 1 comprises: a semiconductor chip 2 having an imaging region 2a; a translucent plate 3 which covers the imaging region 2a; and a spacer 4 which is provided between the semiconductor chip 2 and the translucent plate 3 so as to surround the imaging region 2a to bond the semiconductor chip 2 and the translucent plate 3 and which has a height of 0.5 mm and over. |
