发明名称 |
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To inhibit chipping of a semiconductor layer associated with dicing cut.SOLUTION: A semiconductor device comprises a chip inhibition member which has a Young's modulus higher than that of a transparent resin layer and which is formed with respect a dicing cut part in a pre-singulation layer structure in contact with a semiconductor layer. In comparison with a cavityless structure in the past in which a transparent resin layer having a comparatively low Young's modulus contacts a semiconductor layer, chatter (vibration) of the semiconductor layer in dicing cut can be inhibited and clogging of a dicing blade can be inhibited and chipping of the semiconductor layer associated with the dicing cut can be effectively inhibited. |
申请公布号 |
JP2014045142(A) |
申请公布日期 |
2014.03.13 |
申请号 |
JP20120187927 |
申请日期 |
2012.08.28 |
申请人 |
SONY CORP |
发明人 |
TAKACHI TAIZO;WAKIYAMA SATORU |
分类号 |
H01L27/14;H01L23/29;H01L23/31;H04N5/369 |
主分类号 |
H01L27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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