| 摘要 |
<p>The invention discloses an x-ray system that produces highly magnified images of objects (200) such as integrated circuits (ICs), printed circuit boards (PCBs), and other IC packaging technologies. Specifically, the object is illuminated by collimated, high-flux x-rays (211) from an extended source (101), with the x-ray wavelength selected to provide contrast for the internal structures of the object. The system also comprises a stage (250) to control the position and orientation of the object; a scintillator (300), positioned in close proximity to the object, that absorbs x-rays and emits visible photons; an optical imaging system (400) that forms a high- resolution magnified image of the photons emitted by the scintillator; and a detector such as a CCD array to convert the image to electronic signals. The x-ray system may also be utilized in methods for high speed metrology or inspection, which in turn enable rapid process development, as well as manufacturing process control and yield management.</p> |
