| 摘要 |
<p>An object of the present invention is to provide a Light Emitting Diode (LED) construction. It is an object of certain embodiments of the present invention to provide an LED Chip-on-Board (COB) construction comprising, a thermally and electrically conductive substrate, at least one semiconductor light emitting die or diode and an electrically insulating material. It is an aspect of certain embodiments that the at least one semiconductor light emitting die bonded to the thermally and electrically conductive substrate. Additionally, the construction comprises an anode or cathode electrode on the insulating material, wherein said anode or cathode electrodes are wire bonded to a first side of the semiconductor light emitting die's electrical contact, and the opposite side of the semiconductor light emitting chip is either anode or cathode. Furthermore, wherein the semiconductor device is encapsulated with an optical encapsulate. The present invention has particular use with red and far red spectrum LED constructions.</p> |
