| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic apparatus which uses Bi content lead-free solder achieving high joining reliability, and to provide a manufacturing method of the electronic apparatus.SOLUTION: An electronic apparatus includes: an electrode included in an electronic component; and a solder joining material formed on a surface of the electrode. The solder joining material includes: a first metal including at least Bi; an alloy of a second metal and a third metal; and the third metal. The second metal may produce an intermetallic compound with Ni. Use of the solder joining material solves a problem of peeling occurring in the electrode after the solder bump formation. Thus, high joining reliability is achieved. |
