APPARATUS AND METHOD FOR INSPECTION OF MARKING

摘要

PROBLEM TO BE SOLVED: To provide an apparatus and method for inspection of marking, requiring no separately extra time for inspecting whether marking of a target chip in a wafer has been normally performed, and capable of performing the inspection without using a prober operation program.SOLUTION: A marking inspection apparatus 100 includes: a voltage application detector 110 which detects application of a voltage to an external circuit; an image pickup unit 120 which captures an image; and a controller 130 which captures an image at at least one predetermined point through the image pickup unit when the application of the voltage is detected by the voltage application detector and determines whether the marking of a target chip has been performed normally on the basis of the captured image.