| 摘要 |
PROBLEM TO BE SOLVED: To provide a Ni or Ni alloy sputtering target suitable for a magnetron sputtering method which may provide uniform deposition on substrates, enabling uniform hardness distribution and uniform leaked magnetic field, and to provide a manufacturing method of the target.SOLUTION: A hot-forged Ni or Ni alloy is formed into a plate body having a predetermined thickness by repeatedly cold-rolling with variation in processing rate. Then, the plate body is annealed before being processed into a predetermined shape to form a target. The target has variation in leaked magnetic flux of 12% or lower on the target surface. |
