| 摘要 |
A first embodiment is a common drain+clip 20. It has a conventional drain contact on its bottom surface and is flip chip mounted on a half-etched leadframe 40 which has external source, gate and drain contacts connected to the sources, gate and common drain of the die 20. Common drain clip 50 connects the drain 30 to external contacts between opposite gate contacts. A second embodiment is a direct drain embodiment+heatslug. The device 80 has a top drain contact 36 that extends to the common drain 30 across the bottom of the die which is flip chip mounted to a half-etched leadframe having external source, gate and drain contacts connected to the sources, gates and common drain of the die 80. |
