发明名称 |
EXTRUSION-RESISTANT SOLDER INTERCONNECT STRUCTURES AND METHODS OF FORMING |
摘要 |
Various embodiments include methods of forming interconnect structures, and the structures formed by such methods. In one embodiment, a method can include: providing a precursor interconnect structure having: a photosensitive polyimide (PSPI) layer; a controlled collapse chip connection (C4) bump overlying the PSPI layer; and a solder overlying the C4 bump and contacting a side of the C4 bump. The method can further include recessing a portion of the PSPI layer adjacent to the C4 bump to form a PSPI pedestal under the C4 bump. The method can additionally include forming an underfill abutting the PSPI pedestal and the C4 bump, wherein the underfill and the solder form an interface separated from the PSPI pedestal. |
申请公布号 |
US2014070401(A1) |
申请公布日期 |
2014.03.13 |
申请号 |
US201213610262 |
申请日期 |
2012.09.11 |
申请人 |
DAUBENSPECK TIMOTHY H.;GAMBINO JEFFREY P.;MUZZY CHRISTOPHER D.;SAUTER WOLFGANG;SULLIVAN TIMOTHY D.;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DAUBENSPECK TIMOTHY H.;GAMBINO JEFFREY P.;MUZZY CHRISTOPHER D.;SAUTER WOLFGANG;SULLIVAN TIMOTHY D. |
分类号 |
H01L21/306;H01L23/498 |
主分类号 |
H01L21/306 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|