发明名称 METHOD FOR FABRICATING A TRENCH STRUCTURE, AND A SEMICONDUCTOR ARRANGEMENT COMPRISING A TRENCH STRUCTURE
摘要 A semiconductor device, in which a first trench section is produced proceeding from a surface of a semiconductor body into the semiconductor body. A semiconductor layer is produced above the surface and above the first trench section. A further trench section is produced in the semiconductor layer in such a way that the first trench section and the further trench section form a continuous trench structure.
申请公布号 US2014073110(A1) 申请公布日期 2014.03.13
申请号 US201314084166 申请日期 2013.11.19
申请人 INFINEON TECHNOLOGIES AUSTRIA AG 发明人 HIRLER FRANZ;KAUTZSCH THORALF;MAUDER ANTON;RUEB MICHAEL;SCHULZE HANS-JOACHIM;STRACK HELMUT;WILLMEROTH ARMIN
分类号 H01L21/762 主分类号 H01L21/762
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