发明名称 |
CURABLE SILICONE COMPOSITION, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE |
摘要 |
The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane composed of: (A-1) a linear organopolysiloxane having at least two silicon-bonded alkenyl groups in a molecule, and (A-2) a resin-like organopolysiloxane including 1.5 to 5.0% by weight alkenyl groups; (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (C) a linear dialkyl polysiloxane having a viscosity at 25°C of 2 to 10 mm2/s and having alkenyl groups capping both molecular chain terminals; and (D) a hydrosilylation reaction catalyst. The curable silicone composition forms a cured product having low surface tackiness and a low coefficient of friction. |
申请公布号 |
WO2014038728(A2) |
申请公布日期 |
2014.03.13 |
申请号 |
WO2013JP74781 |
申请日期 |
2013.09.06 |
申请人 |
DOW CORNING TORAY CO., LTD. |
发明人 |
YOSHIDA, HIROAKI;MIYAMOTO, YUSUKE;YOSHITAKE, MAKOTO;YOSHIDA, SHIN |
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