| 摘要 |
PROBLEM TO BE SOLVED: To provide a rigid flexible circuit board and a manufacturing method therefor, and a rigid flexible circuit plate and a manufacturing method therefor.SOLUTION: A rigid flexible circuit board includes: a flexible circuit board having an exposure region and a pressure bonding region connected therewith; a core substrate connected with the pressure bonding region; a first adhesive sheet for lamination and a second adhesive sheet for lamination located on both sides of the core substrate and pressure bonding region; and a fifth conductive circuit layer and a sixth conductive circuit layer formed, respectively, on the surfaces of the first and second adhesive sheets for lamination separated from the core substrate. Electric connection bodies are formed on both first and second adhesive sheets for lamination, and the conductive circuit layer of a flexible circuit board is in electric conduction with the fifth and sixth conductive circuit layers by the electric connection bodies. A manufacturing method for the rigid flexible circuit board, a rigid flexible circuit plate and a manufacturing method for the rigid flexible circuit plate are also provided. |
