发明名称 |
CHARGE SHARING TESTING OF THROUGH-BODY-VIAS |
摘要 |
In accordance with one aspect of the present description, an integrated circuit die has a plurality of through-body-vias and a testing circuit on board the die which allows charges on a first and second through-body-via to redistribute between them to provide an indication whether one or both of the first and second through-body-vias has a defect. Other aspects are described. |
申请公布号 |
US2014070838(A1) |
申请公布日期 |
2014.03.13 |
申请号 |
US201213977659 |
申请日期 |
2012.06.29 |
申请人 |
VUKIC MLADENKO;KOLLURU KALYAN C. |
发明人 |
VUKIC MLADENKO;KOLLURU KALYAN C. |
分类号 |
G01R31/28 |
主分类号 |
G01R31/28 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|