发明名称 DIP SOCKET
摘要 Disclosed herein is a dip socket, including: a first pin connecting part and a second pin connecting part provided by forming a plurality of connecting members connected with a plurality of pins of a dip module in a line, respectively; and a width controlling means provided between the first pin connecting part and the second pin connecting part and configured to control a width between the first pin connecting part and the second pin connecting part.
申请公布号 US2014073177(A1) 申请公布日期 2014.03.13
申请号 US201313757579 申请日期 2013.02.01
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE KANG HYUN
分类号 H05K7/10 主分类号 H05K7/10
代理机构 代理人
主权项
地址