| 摘要 |
PROBLEM TO BE SOLVED: To reduce the thickness of a substrate as a whole.SOLUTION: A substrate (1) with a built-in component has wiring boards (10, 20, 30) laminated therein, on at least one surface of which a wiring pattern is formed and in which a conductive paste via is formed, and has an electronic component (90) built therein. First wiring (95) is formed on at least one surface in a laminating direction of the electronic component (90). In the wiring board (20) arranged in the same layer as the electronic component, an opening (29) is formed at a part of the wiring board (20), and second wiring (22) composed of a wiring pattern is formed around the opening (29). The electronic component (90) is stored in the opening (29) of the wiring board (20). The first wiring (95) of the electronic component (90) is connected to the second wiring (22) via a conductor (99) arranged on a side surface of the electronic component (90). |
