| 发明名称 |
HIGH DENSITY THREE-DIMENSIONAL ELECTRICAL INTERCONNECTIONS |
| 摘要 |
Implementations relate to methods, devices produced by the method, and systems using the devices, for forming three-dimensional interconnect structures for ink piezoelectric printheads. |
| 申请公布号 |
US2014071208(A1) |
申请公布日期 |
2014.03.13 |
| 申请号 |
US201213614879 |
申请日期 |
2012.09.13 |
| 申请人 |
WEN XUEJIN;NYSTROM PETER J.;REDDING GARY D.;MA JUN;XEROX CORPORATION |
发明人 |
WEN XUEJIN;NYSTROM PETER J.;REDDING GARY D.;MA JUN |
| 分类号 |
B41J2/045;H01L41/04;H01L41/22 |
主分类号 |
B41J2/045 |
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