发明名称 MICROMACHINED ULTRASONIC TRANSDUCER ARRAY
摘要 A micromachined ultrasonic transducer (MUT) array includes a printed circuit board, an alignment plate formed on the printed circuit board, the alignment plate having a plurality of cavities formed therein and a plurality of protruding portions respectively formed between neighboring cavities of the plurality of cavities, and a plurality of MUT modules formed on the plurality of the cavities and the plurality of the protruding portions of the alignment plate. In the MUT array, each of the plurality of MUT modules includes an application-specific integrated circuit (ASIC) arranged on the alignment plate and an MUT arranged on the ASIC.
申请公布号 US2014070669(A1) 申请公布日期 2014.03.13
申请号 US201313957759 申请日期 2013.08.02
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JEONG BYUNG-GIL
分类号 B06B1/06;B06B1/02 主分类号 B06B1/06
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