发明名称 |
Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangements |
摘要 |
A method for manufacturing a chip arrangement is provided, the method including: forming a hole in a carrier including at least one chip, wherein forming a hole in the carrier includes: selectively removing carrier material, thereby forming a cavity in the carrier, forming passivation material over one or more cavity walls exposed by the selective removal of the carrier material; selectively removing a portion of the passivation material and further carrier material exposed by the selective removal of the passivation material, wherein a further portion of the passivation material remains over at least one cavity side wall; the method further including subsequently forming a layer over the further portion of passivation material remaining over the at least one cavity side wall. |
申请公布号 |
US2014070376(A1) |
申请公布日期 |
2014.03.13 |
申请号 |
US201213609306 |
申请日期 |
2012.09.11 |
申请人 |
HESS REINHARD;UMMINGER KATHARINA;MAIER GABRIEL;MENATH MARKUS;MACKH GUNTHER;EDER HANNES;HEINRICH ALEXANDER;INFINEON TECHNOLOGIES AG |
发明人 |
HESS REINHARD;UMMINGER KATHARINA;MAIER GABRIEL;MENATH MARKUS;MACKH GUNTHER;EDER HANNES;HEINRICH ALEXANDER |
分类号 |
H01L21/768;H01L29/02 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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