发明名称 HEAT TREATMENT APPARATUS
摘要 A heat treatment apparatus includes: a reaction tube processing a plurality of substrates; a support member supporting the reaction tube; a flange protruding outwardly from a lower end of the reaction tube: a concave portion formed in an outer periphery of the flange; and a rotatable roller installed in a top surface of the support member. The rotatable roller engages the concave portion and positions the reaction tube in a circumferential direction.
申请公布号 US2014072925(A1) 申请公布日期 2014.03.13
申请号 US201314023093 申请日期 2013.09.10
申请人 TOKYO ELECTRON LIMITED 发明人 KANEKO HIROFUMI
分类号 F27D1/00;F27D7/02 主分类号 F27D1/00
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