Planar helical coil e.g. three spiral superposed coils, has central terminal made by semiconductor substrate using metal one-semiconductor contacts in external supplying unit, where metal one-semiconductor contacts are provided at coil

摘要

The coil (17) has a central terminal integrated in a planar dig-insulating silicon semiconductor, where the coil lies in a center of a dig-isolated part. An external supplying unit (14) is formed in and from a metal layer (15), and the central terminal is made by semiconductor substrate (12) using metal 1-semiconductor contacts (18) in the external supplying unit, where the metal 1-semiconductor contacts are provided at the coil. The metal 1-semiconductor contacts are formed on a bar-like, highly doped region in the semiconductor substrate.