发明名称 DICING METHOD AND DICING DEVICE
摘要 PROBLEM TO BE SOLVED: To unfailingly obtain a chip which achieves high desired reliability without causing cracks in the chip during dicing even when warpage occurs in a substrate.SOLUTION: A substrate fixing part 1 including a substrate holding surface 1a having a shape that is bent relative to one axis is used to forcibly hold a substrate 10 on the substrate holding surface 1a so as to correspond to the shape of the substrate holding surface 1a in a fixing manner. A cutter 2 is used to dice the substrate 10 in parallel with the one axis.
申请公布号 JP2014045144(A) 申请公布日期 2014.03.13
申请号 JP20120187948 申请日期 2012.08.28
申请人 FUJITSU SEMICONDUCTOR LTD 发明人 TERAYAMA SATORU
分类号 H01L21/301;H01L21/683 主分类号 H01L21/301
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