摘要 |
PROBLEM TO BE SOLVED: To unfailingly obtain a chip which achieves high desired reliability without causing cracks in the chip during dicing even when warpage occurs in a substrate.SOLUTION: A substrate fixing part 1 including a substrate holding surface 1a having a shape that is bent relative to one axis is used to forcibly hold a substrate 10 on the substrate holding surface 1a so as to correspond to the shape of the substrate holding surface 1a in a fixing manner. A cutter 2 is used to dice the substrate 10 in parallel with the one axis. |