SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which improves productivity.SOLUTION: In a semiconductor device manufacturing method of the present embodiment, a semiconductor wafer has bump electrodes 2 provided on a circuit surface and the semiconductor device manufacturing method comprises: a first process of forming an insulation resin layer on a whole area of the circuit surface so as to embed the bump electrodes 2; a second process of attaching a back grind tape to the insulation resin layer where the bump electrodes 2 are not exposed and thinning the semiconductor wafer; a third process of fixing the semiconductor wafer to a wafer ring; a fourth process of dicing the semiconductor wafer; a pickup process of picking up singulated semiconductor chips 11 by dicing; and an electrical connection process of electrically connecting the bump electrodes 2 of the semiconductor chip 11 and a substrate electrode 14 of a substrate 15. The insulating resin layer includes a polyimide resin and an epoxy resin and a hardening agent as ingredients.