| 摘要 |
The present invention pertains to a power module that solder-connects both surfaces of a chip, prevents solder wetting towards a pedestal section side surface, which causes non-connection of the solder and chip displacement, and prevents the peeling away of molding resin, which is the cause of chip destruction and shortening of solder life. The semiconductor device has a configuration in which: the wetting properties of the solder are reduced by the pedestal section being integrally formed in one lead frame and by roughening the side surface of the pedestal section and the surface of the lead frame main body; and the solder connection surface of the pedestal section is not roughened and the solder wetting properties thereof are retained. As a result, flaws during solder connection are reduced and a highly reliable power module is obtained (see fig. 5). |
