| 摘要 |
PROBLEM TO BE SOLVED: To provide a multiply demarcated lead frame and a method of manufacturing the same capable of preventing deformation and the like of a tie-bar in a vicinity of a continuous part between the other end part of a suspension lead and an end part of the tie-bar, and to provide a method of manufacturing a semiconductor device using the multiply demarcated lead frame.SOLUTION: A multiply demarcated lead frame comprises: a plurality of unit lead frames arranged in a matrix and each having a semiconductor element mounting part mounting a semiconductor element on an upper surface, a suspension lead whose one end part is continuous to the semiconductor element mounting part and whose the other end part is branched into two, and a plurality of leads juxtaposed around the semiconductor element mounting part; and a tie-bar provided to a boundary part between the unit lead frames and supporting the plurality of leads. The branched end part of one unit lead frame is continuous to that of an adjacent other unit lead frame, and the respective both-end parts of the tie-bar are continuous to the continuous part between the branched end part of adjacent two unit lead frames. A distance from a branch point of the suspension lead to the branched end part is longer than that from the continuous part of the branched end part to the closest lead. |
