| 摘要 |
PROBLEM TO BE SOLVED: To provide a component mounting board having a high bonding strength between a wiring board and electronic components and bonding failure is hardly generated between the wiring board and the electronic components even when repair processing is made.SOLUTION: In a component mounting board 10, a wiring layer 12 is formed over the surface 11a of an insulation substrate 11 and the wiring layer 12 is coated by a resist 13. The resist 13 includes an opening 14 formed therein. In the opening 14, a terminal 21 of the electronic component 2 has a joint plane 12a electrically connected to the surface of the wiring layer 12 is exposed from the resist 13, and the entire of the opening 14 is covered by the electronic component 2. A first space 31 within the opening 14 closed by the wiring layer 12 and the electronic component 2 is filled with solder 41. The solder 41 electrically connects the terminal 21 and the joint plane 12a to each other. In a second space 32 formed by the upper face of the resist 13 and the side faces of the electronic component 2, a hardened material 42 of a thermosetting resin joins the resist 13 and the electronic component 2 to each other. |
