| 摘要 |
PROBLEM TO BE SOLVED: To provide a physical quantity sensor that does not readily allow application of stresses from a mounted member to a sensor unit and can readily accomplish a bonding process, and a manufacturing method therefor.SOLUTION: In a rear face of a pedestal 30 reverse to its front face to be joined to a sensor chip 20, a frame-shaped groove 31 is formed, a sensor unit 40 comprising the sensor chip 20 joined to the pedestal 30 provided with a central protrusion 32 formed within the groove 31 and a peripheral protrusion 33 formed outside the groove 31 is made ready. Also, a mountable member 10 having a dent 11a in which the sensor unit 40 is to be mounted is made ready. And on a reverse side to the sensor chip 20 on the pedestal 30, a part deprived of one side reverse to the sensor chip 20 on the peripheral protrusion 33 and containing the central protrusion 32 is joined to one face via a joining member 70. After that, wire bonding is performed while keeping the one face in contact with the peripheral protrusion 33. |
