| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a solder resist and a substrate for a package, capable of differentiating a surface roughness of an inner chip mounting region from a surface roughness of an outer upper package mounting region.SOLUTION: A method for forming a solder resist includes the steps of: forming a plugged SR region 30a by performing a laser ablation process on a first solder resist inner region 30'; changing a surface roughness by performing a desmear process on a surface of the first solder resist inner region 30' where the plugged SR region 30a is formed; and forming a second solder resist SMD region 30'' by coating, exposing and developing a solder resist 30 on a substrate 10 after the desmear process, curing the coated solder resist region covering an edge of a POP pad 21, and removing the remaining solder reset region coated on an inner region of the POP pad 21 and the first solder resist inner region 30'. |
