发明名称 APPARATUS AND METHOD FOR PLASMA PROCESSING
摘要 PROBLEM TO BE SOLVED: To easily lift a substrate from a stage after the substrate has been subjected to plasma processing.SOLUTION: A plasma processing apparatus 10 includes: a stage 36 mounting a substrate 28 fixed to a support 26 thereon; a blade 20 conveying the substrate 28; and movable mechanisms 24, 25 moving the blade 20. At least a part of the surface of the blade 20 is formed of a conductor. The conductor is grounded. The movable mechanisms 24, 25 move the blade 20 so that the conductor is brought into contact with a conductive film 29 formed at least on the substrate 28 on the stage 36.
申请公布号 JP2014044991(A) 申请公布日期 2014.03.13
申请号 JP20120185097 申请日期 2012.08.24
申请人 PS4 LUXCO S A R L 发明人 FUJII SEIYA
分类号 H01L21/677;B25J15/08;B65G49/07;C23C14/56;H01L21/205;H01L21/3065;H01L21/31 主分类号 H01L21/677
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