CURABLE COMPOSITION COMPRISING BIS-BENZOXAZINE, METHOD OF CURING, AND THE CURED COMPOSITION SO FORMED

摘要

The present invention deals with a novel curable composition comprising bis-benzoxazine and an amine-functionalized triazine, especially a di-isoimide, and the use thereof in the preparation of encapsulated printed wiring boards, especially flexible printed wiring boards. The curable composition hereof beneficially effects crosslinking of bis-benzoxazine at a lower temperature than has heretofore been provided in the art.