发明名称 SURFACE-TREATED COPPER FOIL AND LAMINATED BOARD USING SAME
摘要 <p>Provided are surface-treated copper foil and a laminated board using this surface-treated copper foil which yields superior resin transparency after the copper foil has been etched and removed. After surface-treated copper foil has been applied to both surfaces of a polyimide resin substrate on the surface-treated side, the copper foil on both surfaces is etched and removed, and a print on which a linear mark has been printed is photographed. In the resulting observation point/brightness graph, the difference between the top average value Bt and the bottom average value Bb of the brightness curve produced in the portion at the end of the mark in which the mark has not been rendered is DeltaB (DeltaB = Bt-Bb). Sv defined by Equation (1) below is equal to or greater than 3.5, where t1 is the value indicating the position of the intersection point closest to the linear mark among the intersection points of the brightness curve with Bt, and t2 is the value indicating the intersection point closest to the linear mark among the intersection points of the brightness curve to 0.1 DeltaB in the depth range from the intersection points between the brightness curve and Bt to 0.1 DeltaB with reference to Bt in the observation point/brightness graph. Sv = (DeltaB × 0.1)/(t1 - t2) (1)</p>
申请公布号 WO2014038716(A1) 申请公布日期 2014.03.13
申请号 WO2013JP74438 申请日期 2013.09.10
申请人 JX NIPPON MINING & METALS CORPORATION 发明人 ARAI,HIDETA;MIKI,ATSUSHI;ARAI,KOHSUKE;NAKAMURO,KAICHIRO
分类号 C25D7/06;B21B1/40;B21B3/00;B32B15/08;C25D1/04;H05K1/09 主分类号 C25D7/06
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