POWER SEMICONDUCTOR MODULE, POWER CONVERSION APPARATUS AND POWER SEMICONDUCTOR MODULE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a power semiconductor module which is excellent in heat dissipation capacity, productivity and terminal connection reliability.SOLUTION: A power semiconductor module 30 comprises a case wall part 33A including: a heat dissipation part 331 to which a conductor plate 104a is depressed via an insulation member 102; a frame part which surrounds the heat dissipation part 331; and a ring-shaped connection part 332 which connects an outer periphery of the heat dissipation part 331 and an inner periphery of the frame part. The ring-shaped connection part 332 includes: a first thin part 332a which is connected to the heat dissipation part 331; a second thin part 332c which is connected to the frame part 335; and a thick part 332b which is provided between the first and second thin parts 332a, 332c. With this configuration, by depressing the heat dissipation part 331 in a case inner side direction, snap buckling occurs at the connection part 332 and the heat dissipation part 331 is pressed into a sealed body 107. Since the first thin part 332a is inclined so as to be positioned in the case inner side direction than the second thin part 332c, a state where the heat dissipation part 331 is depressed to the sealed body 107 is maintained by a reaction force of the connection part 332.