发明名称 |
Methods and Apparatus for Sensor Module |
摘要 |
Methods and apparatus for integrating a CMOS image sensor and an image signal processor (ISP) together using an interposer to form a system in package device module are disclosed. The device module may comprise an interposer with a substrate. An interposer contact is formed within the substrate. A sensor device may be bonded to a surface of the interposer, wherein a sensor contact is bonded to a first end of the interposer contact. An ISP may be connected to the interposer, by bonding an ISP contact in the ISP to a second end of the interposer contact. An underfill layer may fill a gap between the interposer and the ISP. A printed circuit board (PCB) may further be connected to the interposer by way of a solder ball connected to another interposer contact. A thermal interface material may be in contact with the ISP and the PCB. |
申请公布号 |
US2014070348(A1) |
申请公布日期 |
2014.03.13 |
申请号 |
US201213606289 |
申请日期 |
2012.09.07 |
申请人 |
YEE KUO-CHUNG;YU CHUN HUI;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
YEE KUO-CHUNG;YU CHUN HUI |
分类号 |
H01L31/0232;H01L31/18 |
主分类号 |
H01L31/0232 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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