Method for manufacturing semiconductor stack for stacking semiconductor chips with components for three-dimensional integration of electronic circuit, involves arranging through-contacts in aperture after connecting stack components

摘要

The method involves providing electric conductors (4) with three stack components (1-3). The stack component (2) is arranged on stack component (1) and connected with stack component (1). The stack component (3) is arranged on stack component (2) and connected with stack components (1,2). The through-contacts (5) are provided between stack components (2,3) for electrical interconnection between conductors. A semiconductor layer or substrate is formed on one stack component. The through-contacts of stack component (2) are arranged in aperture (15) after connecting stack components (1,2). An independent claim is included for semiconductor stack.