Component e.g. semiconductor chip, for use in electronic device, has insulating layer arranged above first metal coating, second metal coating applied above insulating layer, and ductile metal film arranged between metal coatings

摘要

The component (100) has a first metal coating (120) applied in a semiconductor substrate e.g. silicon. An insulating layer (140) is arranged above the first metal coating. A second metal coating is applied above the insulating layer. A ductile metal film (180) is arranged between the first metal coating and the second metal coating. A metal barrier layer (170) is arranged between the two metal coatings. The ductile metal film is directly located on the metal barrier layer. The insulating layer is directly located on the ductile metal film that is made of undoped aluminum. Independent claims are also included for the following: (1) a method for manufacturing a component (2) a method for testing a component (3) an electronic device.