| 摘要 |
PROBLEM TO BE SOLVED: To provide a bump recognition method of an electronic component 2 capable of recognizing all bumps of an electronic component for which lack of some bumps is allowed.SOLUTION: A bump recognition method of an electronic component includes an image pick-up step S1 for capturing the image of a rectangular bottom surface of an electronic component with bumps arranged on the bottom surface of the component, a first image processing step S2 for specifying at least two continuous sides of a rectangle, an operation step S3 for obtaining the data of temporary center and inclination of the bottom surface of the component in an XY coordinate system, a bump position prediction step S4, and a second image processing step S5. In the bump position prediction step S4, position of the bump in image data is predicted based on the data of temporary center and inclination of the bottom surface of the component obtained in the operation step S3, and known data capable of specifying the position of the bump for the center of the bottom surface of the component in the XY coordinate system. In the second image processing step S5, image processing for recognizing the outer shape of the bump is performed for a position predicted in the bump position prediction step S4. |
