| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed-circuit board capable of highly accurately controlling solder ball positions by preventing aggregation of solder balls and preventing a solder ball from coming off from a junction pad when a flux is applied to the solder ball.SOLUTION: A method for manufacturing a printed-circuit board includes the steps of: providing a base substrate including a junction pad; forming a solder resist in which a first opening is formed so as to expose the upper part of the junction pad; forming a mask in which a second opening is formed on the upper part of the solder resist so as to expose the upper part of the junction pad; mounting the solder ball on the upper part of the junction pad; applying a flux to the upper part of the solder ball; reflowing the solder ball; and removing the mask. |
