| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which can improve yield of a semiconductor device manufactured by bonding of a first substrate and a second substrate.SOLUTION: A semiconductor device manufacturing method according to one embodiment comprises a first process, a second process and a third process. In the first process, a surface of at least one between surfaces of a first substrate and a second substrate is polished. In the second process, the surface of the substrate, which is polished in the first process is roughened. In the third process, a surface of the other substrate is bonded to the surface of the substrate, which is roughened in the second process. |
