| 摘要 |
Disclosed herein is an electro-copper plating apparatus in which a cathode, an insoluble anode, a copper ball, and a plating solution are included in a single bath, wherein the plating solution includes manganese oxide; or an electro-copper plating apparatus including: a main bath including a cathode, an insoluble anode, and a plating solution; and a dissolution bath including a copper ball, and manganese oxide. According to the present invention, the manganese oxide having higher oxidation-reduction potential instead of using Fe3+ of the related art as the copper source in the electro-copper plating apparatus may be used to obtain a high effect in suppressing surface plating even at a low concentration. |
