| 摘要 |
A method of fabricating a semiconductor package is provided, including: providing a substrate having opposite first and second surfaces and a plurality of conductive through holes penetrating the first and second surfaces, disposing the substrate on a first carrier through the second surface thereof, and keeping the first carrier flat and free of warpage; attaching at least a first semiconductor chip to the first surface of the substrate and electrically connecting the first semiconductor chip and the substrate; removing the first carrier; and attaching the substrate to a packaging substrate through the second surface thereof and electrically connecting the substrate and the packaging substrate, thereby preventing the semiconductor package from warpage, increasing product yield, reducing fabrication cost, and improving thermal dissipation. |
