ADHESIVE COMPOSITION, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an adhesive composition which is capable of highly satisfying processability at low temperature (low-temperature sticking property) and reflow resistance and achieving sufficient thermal fluidity in the B-stage.SOLUTION: The adhesive composition for sticking to a wafer rear surface according to the present invention contains: (A) a thermoplastic resin; and (B) a thermosetting component, and does not contain conductive particles. The thermosetting component (B) contains (B1) a reactive compound having a (meth)acrylic group and an epoxy group in the molecule and/or (B2) a reactive compound having a (meth)acrylic group and a phenolic hydroxyl group in the molecule.