| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board in which, by securing adhesive strength of wiring, the wiring can be inhibited from being fallen down or peeled off in the middle of a manufacturing process.SOLUTION: A method for manufacturing a wiring board includes a resin insulation layer, and a wiring layer formed on the resin insulation layer. This method includes a step in which a part of a metal layer is removed by irradiating the metal layer on the resin insulation layer with laser, and wiring of the wiring layer is formed. The laser is applied so as to be trailed to both ends in the width direction of the wiring. |
