| 摘要 |
Disclosed is a deposition apparatus including a susceptor that can simultaneously perform a deposition process on wafers and improve the deposition uniformity of each wafer. According to the present invention, the deposition apparatus includes a susceptor where the wafer is mounted. The susceptor includes a main plate and sub plates where the wafer is mounted. The main plate rotates around a shaft that penetrates the center of the main plate. At least one among the sub plates self-rotates around a shaft that penetrates the center of a corresponding sub plates. The rotation speed of the sub plate is independently controlled. |
