| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a packaged device manufacturing method which is suitable for restraining moisture in an inner space of a package. <P>SOLUTION: The packaged device manufacturing method includes a mounting step of mounting a device chip 10 in a recess of a package body 21 which has the recess and is provided with an electrode pad 23 in the inside of the recess; a step of electrically connecting the device chip 10 and the electrode pad 23 by a wiring component 26; a coating step of depositing Parylene 30 in the inside of the recess of the package body 21; and a joining step of jointing a lid 22 for closing the recess and the package body 21. <P>COPYRIGHT: (C)2011,JPO&INPIT |
