| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive film for circuit connection that is capable of maintaining an excellent connection reliability and suppressing deformation of a glass substrate even when used for connecting a glass substrate having a thickness thinner than that of a conventional circuit substrate with a semiconductor element, and that has an excellent film forming property. <P>SOLUTION: A adhesive film for circuit connection 10 has: a conductive adhesive layer 3b containing an adhesive composition 4b and conductive particles 5; and an insulation adhesive layer 3a containing an adhesive composition 4a and not containing the conductive particles. A thickness Ti of the insulation adhesive layer 3a and a thickness Tc of the conductive adhesive layer 3b satisfy the relation of the following formula (1): Ti/Tc≥1.5...(1) <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
