发明名称 Protein complexes and methods of manufacturing bispecific antibodies using the protein complexes
摘要 A protein complex comprising (i) a first fusion protein comprising (a) a first polypeptide that comprises a first antigen-binding site and (b) a first binding protein linked to a terminus of the first polypeptide; and (ii) a second fusion protein comprising (a) a second polypeptide that comprises a second antigen-binding site and (b) a second binding protein linked to a terminus of the second polypeptide, wherein the protein complex comprises an amino acid sequence that enables cleavage between the first polypeptide and the first binding protein, and/or between the second polypeptide and the second binding protein, as well as a method for preparing a bi-specific antibody and related methods and compositions.
申请公布号 EP2706069(A1) 申请公布日期 2014.03.12
申请号 EP20130183787 申请日期 2013.09.10
申请人 SAMSUNG ELECTRONICS CO., LTD 发明人 LEE, JUNG-WOOK;KIM, MIN-KYUNG;SHIM, SEON-HUI;LEE, JAE-IL
分类号 C07K16/22;C07K16/28;C07K16/46;C07K19/00;C12N15/62 主分类号 C07K16/22
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