发明名称 |
Protein complexes and methods of manufacturing bispecific antibodies using the protein complexes |
摘要 |
A protein complex comprising (i) a first fusion protein comprising (a) a first polypeptide that comprises a first antigen-binding site and (b) a first binding protein linked to a terminus of the first polypeptide; and (ii) a second fusion protein comprising (a) a second polypeptide that comprises a second antigen-binding site and (b) a second binding protein linked to a terminus of the second polypeptide, wherein the protein complex comprises an amino acid sequence that enables cleavage between the first polypeptide and the first binding protein, and/or between the second polypeptide and the second binding protein, as well as a method for preparing a bi-specific antibody and related methods and compositions. |
申请公布号 |
EP2706069(A1) |
申请公布日期 |
2014.03.12 |
申请号 |
EP20130183787 |
申请日期 |
2013.09.10 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD |
发明人 |
LEE, JUNG-WOOK;KIM, MIN-KYUNG;SHIM, SEON-HUI;LEE, JAE-IL |
分类号 |
C07K16/22;C07K16/28;C07K16/46;C07K19/00;C12N15/62 |
主分类号 |
C07K16/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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