发明名称 COVER FILM
摘要 Disclosed is a cover film, which comprises at least a base layer (A), an intermediate layer (B), a releasing layer (C) and a heat seal layer (D) that can be heat-sealed to a carrier tape, and wherein the heat seal layer (D) contains, as a main component, a styrene-acrylic copolymer that has a mass average molecular weight of 5000 to 20000. This cover film is suppressed in variation in release strength when separated from the carrier tape, and is capable of reducing problems in the mounting process of electronic components such as rupture of the cover film during the separation.
申请公布号 KR20140031258(A) 申请公布日期 2014.03.12
申请号 KR20137029643 申请日期 2011.04.18
申请人 DENKI KAGAKU KOGYO KABUSHIKI KAISHA 发明人 SASAKI AKIRA;TOKUNAGA HISATSUGU;FUJIMURA TETSUO
分类号 B65D85/86;B32B27/08;B65D65/40 主分类号 B65D85/86
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