发明名称 |
METHOD FOR IMPARTING EMBOSSED SHAPES TO ACRYLIC RESIN FILM |
摘要 |
Disclosed is a method for imparting an embossed shape to an acrylic resin film by an embossing die at a temperature T[°C] represented by the following formula (1), wherein the storage modulus (E') under a measurement frequency of 0.1 Hz of the acrylic resin film at the temperature T[°C] is 0.20 to 0.36 Mpa and the elongation at break under the following evaluation method is 100% or more:
(T D : heat distortion temperature of acrylic resin film)
<Evaluation method of elongation at break>
Test specimen: film-form material having a thickness of 50 µm and a width of 15 mm
Tensile test conditions: initial chuck-to-chuck distance: 50 mm, tensile speed: 500 mm/min, temperature: 23°C;
an embossed shape-imparting property, a film handling property and a die-release property being excellent in this method. |
申请公布号 |
EP2514582(B1) |
申请公布日期 |
2014.03.12 |
申请号 |
EP20100837631 |
申请日期 |
2010.12.15 |
申请人 |
MITSUBISHI RAYON CO., LTD. |
发明人 |
ABE, JUNICHI;SUEMURA, KENJI;YAMAGUCHI, YUKO |
分类号 |
B29C59/00;B29C59/02;B29K33/04;B29L7/00;C08L33/04 |
主分类号 |
B29C59/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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