发明名称 |
LED package, LED package module having the same and manufacturing method thereof, and head lamp module having the same and control method thereof |
摘要 |
<p>Disclosed are an LED package, an LED package module having the same and a manufacturing method thereof, and a head lamp module having the same and a control method thereof. The light emitting diode package includes: a package substrate; a light emitting diode chip mounted on one surface of the package substrate; an electrode pad formed on the other surface of the package substrate and electrically connected to the light emitting diode chip; and a heat radiation pad formed on the other surface of the package substrate and electrically insulated from the electrode pad.
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申请公布号 |
EP2327582(A3) |
申请公布日期 |
2014.03.12 |
申请号 |
EP20100192862 |
申请日期 |
2010.11.29 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE, YOUNG JIN;KIM, HYUNG KUN |
分类号 |
B60Q1/04;F21S8/12;H01L33/64;H05K1/02 |
主分类号 |
B60Q1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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