| 摘要 |
<p>A process for producing a circuit carrier, including providing a moulded part containing a thermoplastic composition including a) a thermoplastic resin and b) a laser direct structuring additive in an amount of at least 1 wt % with respect to the weight of the total composition, the laser direct structuring additive containing tin or copper comprising antimony-doped tin oxide and having a CIELab colour value L* of at least 45 and irradiating areas of the part on which conductive tracks are to be formed with laser radiation, and subsequently metalizing the irradiated areas.</p> |
