发明名称 SPACER BONDING SYSTEM
摘要 A spacer bonding system according to the present invention comprises; a spacer arrangement part which forms multiple spacers attached to a glass substrate into lines at regular intervals; a spray part which sprays binding solutions on the glass substrate in which the spacer is to be attached; a spacer attachment part which transfers the spacers formed into lines in the spacer arrangement part to positions of the glass substrate sprayed with the binding solutions when the spray part sprays the binding solutions on the glass substrate in which the spacer is to be attached; and a hardening part which hardens the binding solutions in order to fix the spacer attached to the binding solutions of the glass substrate, increases uniformity on arrangement by automatically supplying multiple spacers and improves productivity. [Reference numerals] (AA) Direction of operation
申请公布号 KR101373995(B1) 申请公布日期 2014.03.12
申请号 KR20120128644 申请日期 2012.11.14
申请人 HID CO., LTD. 发明人 LEE, YOUNG KEUN
分类号 C03C27/00 主分类号 C03C27/00
代理机构 代理人
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